Overview
Mfr description
Q3-1566 HT RES ADH SEALANT,L,20L-PAIL
- Acetoxy cure system
- Non-sag, paste consistency
- Easy to apply
- Good adhesion on many substrates
- One-component adhesive/sealant
- Cures at room temperature when exposed to moisture in the air
- Stable and flexible from -58°F to 527°F (-50°C to 275°C), with short peaks up to 662°F (350°C)
Compliance & Safety Data
Click on an icon below to learn more about the compliance and safety data
