Overview
Mfr description
7010498094 3M RESIN BOND DIAMOND
- For industrial/occupational use only. Not for consumer sale or use.- Phenolic resin bond supports fast, cool cutting - Delivers fast cut rate and stock removal - Holds shape against tough substrates - Designed for lower temperature operations - Excellent for wet and dry applications - Ideal for small re-grind shops or in-house re-sharpening - Available in shapes 1V1, 1A1 with custom arbor hole
Specifications
- Manufacturer Upc Number00638060033029
- UPC_NO00638060033029
- Abrasive MaterialDiamond
- Overall Diameter5 in
- Overall Thickness0.5 in
- Features & Benefits• For industrial/occupational use only. Not for consumer sale or use.- Phenolic resin bond supports fast, cool cutting - Delivers fast cut rate and stock removal - Holds shape against tough substrates - Designed for lower temperature operations - Excellent for wet and dry applications - Ideal for small re-grind shops or in-house re-sharpening - Available in shapes 1V1, 1A1 with custom arbor hole
- Weight3333.530 g
Compliance & Safety Data
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