Overview
Mfr description
7010497702 3M RESIN BOND DIAMOND
- For industrial/occupational use only. Not for consumer sale or use.- Diamond abrasive capable of removing stock or grinding forms on tungsten carbide, cemented carbide and ceramic work pieces - Durable resin bond resists deterioration from heat, extending the life of the abrasive wheel - Designed for applications where higher stock removal is required - Various wheel shapes and sizes available with arbor holes are made to customer specifications - Designed for dry grinding
Specifications
- Manufacturer Upc Number00638060023082
- UPC_NO00638060023082
- Abrasive MaterialDiamond
- Overall Diameter5 in
- Overall Thickness0.5 in
- Features & Benefits• For industrial/occupational use only. Not for consumer sale or use.- Diamond abrasive capable of removing stock or grinding forms on tungsten carbide, cemented carbide and ceramic work pieces - Durable resin bond resists deterioration from heat, extending the life of the abrasive wheel - Designed for applications where higher stock removal is required - Various wheel shapes and sizes available with arbor holes are made to customer specifications - Designed for dry grinding
- Weight0.801 lb
Compliance & Safety Data
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